|
Áö¸à½º(ÁÖ) |
Áö¸à½º¢ß ¸ÞµðÄ®ÃÊÀ½ÆÄ»ç¾÷ºÎ AOP Engineer ¸ðÁý
°æ±â ¼º³²½Ã ºÐ´ç±¸ | ´ëÇÐ(2~3³â) Á¹¾÷ |
°³¹ß/RA/´ë°ü |
3³â¡è |
»ó½Ãä¿ë |
04.14 |
|
|
Áö¸à½º(ÁÖ) |
Áö¸à½º¢ß ¸ÞµðÄ®ÃÊÀ½ÆÄ»ç¾÷ºÎ EM (Analog&Digital) board de
°æ±â ¼º³²½Ã ºÐ´ç±¸ | ´ëÇÐ(2~3³â) Á¹¾÷ |
°³¹ß/RA/´ë°ü |
3³â¡è |
»ó½Ãä¿ë |
04.14 |
|
|
Áö¸à½º(ÁÖ) |
Áö¸à½º¢ß ¸ÞµðÄ®ÃÊÀ½ÆÄ»ç¾÷ºÎ Imaging SW engineer ¸ðÁý
°æ±â ¼º³²½Ã ºÐ´ç±¸ | ´ëÇÐ(2~3³â) Á¹¾÷ |
°³¹ß/RA/´ë°ü |
½ÅÀÔ |
»ó½Ãä¿ë |
04.14 |
|
|
Áö¸à½º(ÁÖ) |
Áö¸à½º¢ß ¸ÞµðÄ®ÃÊÀ½ÆÄ»ç¾÷ºÎ IOP and Acquisition SW engin
°æ±â ¼º³²½Ã ºÐ´ç±¸ | ´ëÇÐ(2~3³â) Á¹¾÷ |
°³¹ß/RA/´ë°ü |
3³â¡è |
»ó½Ãä¿ë |
04.14 |
|
|
Áö¸à½º(ÁÖ) |
Áö¸à½º¢ß ¸ÞµðÄ®ÃÊÀ½ÆÄ»ç¾÷ºÎ IOP and Imaging SW engineer
°æ±â ¼º³²½Ã ºÐ´ç±¸ | ´ëÇÐ(2~3³â) Á¹¾÷ |
°³¹ß/RA/´ë°ü |
3³â¡è |
»ó½Ãä¿ë |
04.14 |
|
|
Áö¸à½º(ÁÖ) |
Áö¸à½º¢ß Áø´Ü»ç¾÷ºÎ ÅͳÎÀÚµ¿Á¦¾î½Ã½ºÅÛ ¼³°è ´ã´çÀÚ ¸ðÁý
°æ±â ¼º³²½Ã ºÐ´ç±¸ | ´ëÇÐ(2~3³â) Á¹¾÷ |
°³¹ß/RA/´ë°ü |
2³â¡è |
»ó½Ãä¿ë |
04.14 |
|
|
Áö¸à½º(ÁÖ) |
Áö¸à½º¢ß Áø´Ü»ç¾÷ºÎ Field Service Engineer ¸ðÁý
°æ±â ¼º³²½Ã ºÐ´ç±¸ | ´ëÇÐ(2~3³â) Á¹¾÷ |
AS/Á¤ºñ/¼ö¸®/¼³Ä¡ |
½ÅÀÔ |
»ó½Ãä¿ë |
04.14 |
|
|
¿¥µð±×¸°ÀÇ¿ø |
ÀÓ»óº´¸®»ç ä¿ë
°æ±â ¼º³²½Ã ºÐ´ç±¸ | ´ëÇÐ(2~3³â) ÀçÇÐ |
¿¬±¸/¿¬±¸±âȹ |
3³â¡è |
ä¿ë½Ã |
02.17 |
|
|
(ÁÖ)Ƽ¿¤½Ã½ºÅÛ |
±¸¸ÅÀÚÀçºÎ¹® °æ·ÂÀÚ
°æ±â ¼º³²½Ã ºÐ´ç±¸ | ´ëÇÐ(2~3³â) Á¹¾÷ |
»ý»ê/»ý»ê°ü¸® |
5³â¡è |
ä¿ë½Ã |
10.28 |
|